Sr Staff IC Packaging Technologist

Tesla

Responsibilities

In this highly visible role, you will be responsible for advanced IC package technology pathfinding, new technology enablement, package architecture definition and HVM manufacturing.

 

Requirements

  • Bachelor’s Degree with 10+ year experience in semiconductor packaging technology, design and manufacturing process, or the equivalent in experience and evidence of exceptional ability.
  • Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
  • Expert knowledge in optical module integration
  • Solid experience in advanced packaging assembly processes and failure analysis
  • Excellent engineering problem solving skills with strong physics and fundamentals
  • Excellent communication skills to work well with internal, cross functional teams and overseas suppliers
  • Familiar with package design software, APD, Virtuoso, etc.