In this highly visible role, you will be responsible for advanced IC package technology pathfinding, new technology enablement, package architecture definition and HVM manufacturing.
- Bachelor’s Degree with 10+ year experience in semiconductor packaging technology, design and manufacturing process, or the equivalent in experience and evidence of exceptional ability.
- Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
- Expert knowledge in optical module integration
- Solid experience in advanced packaging assembly processes and failure analysis
- Excellent engineering problem solving skills with strong physics and fundamentals
- Excellent communication skills to work well with internal, cross functional teams and overseas suppliers
- Familiar with package design software, APD, Virtuoso, etc.